The present invention relates to a thermoplastic resin composition comprising a rubber-reinforced thermoplastic resin as component and an ethylene–olefin copolymer having a Mooney viscosity of 40 to 110 as component, the amount of component being 1 to 70 parts by weight based on 100 parts by weight of component. In one embodiment, the method comprises providing a semiconductor substrate, epitaxially growing a Ge layer on the substrate, and epitaxially growing a semiconductor layer on the Ge layer, where the semiconductor layer has a thickness of 10 nm or less. The present invention further provides the use of said derivatives or pharmaceutical acceptable salts thereof in the preparation of a medicament for prophylaxis andor treatment tumor or an antiviral medicament. A first flex circuit is connected to the second lands on the circuit board while a second flex circuit is connected to the second lands on the IC. The thick film resistors may be included in a quarter, a half, or a full wheatstone bridge strain gauge circuit.