Techniques for supporting distributed MIMO are described. In some embodiments, scanner mirror has a wide and short aspect ratio that is similar to rotating polygon facets. A third outlet is in fluid communication with a manually operated valve. The chip extension also improves lateral heat dissipation by providing a greater thermal contact area between the cooling structure and the chip and, if needed, the substrate at a much lower cost than using larger die with lower production unit output from a wafer. The proposed method reduces the complexity of the system while maximizing the internal accuracy of the OFDM MIMO decoder and preserving the performance of the system.