A semiconductor package comprises a semiconductor chip, a lid, a plurality of traces, a compliant layer, a plurality of conductive pastes, and a plurality of solder pads. A write element of the invention includes one or more of a recessed first pole, a heat sink layer, and a shortened yoke length. The temperature detecting section detects a temperature of the apparatus, and the control section adjusts a detecting condition of the multiple feed detecting section based on the detected temperature. The write control circuit generates the write address in response to the clock signal and the comparison signal, and a read control signal in response to the comparison signal.