A semiconductor device includes a circuit board and a semiconductor element mounted on the circuit board. The cooler has a housing with fittings on opposite ends for securement to mating fittings in the engine exhaust system to circulate exhaust through heat exchange tubes in the housing. When the endplate is moved relative to the frame in a direction along the longitudinal axis of the frame, the endplate is moved in a direction away from the frame to increase the height of the spacer. A volume-based calling pattern cube is then generated based on the multi-customer profile cube. Embodiments having only a few layers may be embedded into the top layer or top few layers of the organic package substrate.