A tire condition sensing apparatus includes a tire-based sensor for sensing two relative rotational positions of its associated tire relative to the earth’s horizon as the tire rotates and provides first and second signals indicative thereof. A lead frame is provided between a chip and a substrate in a window ball grid array semiconductor package, wherein an active surface of the chip is electrically connected to the lead frame via bonding wires formed in an opening of the substrate and is electrically connected to the substrate via the lead frame. The door drive device is controlled by a door control device. A resilient band or coating may be placed around the implant or one or more grooves, to act as a pressure regulator. The communication system also includes at least one service site connected to the communication network.