Embodiments of the presently-disclosed subject matter include a first laminated structure in which at least one conductor layer and at least one resin insulating layer are alternately formed is formed on a supporting substrate, and a core substrate is formed so as to come into contact with the conductor layer which is the uppermost layer of the first laminated structure. The shim includes a cylindrical sleeve with opposite proximal and distal ends. 0 \u03bcm, and has an antistatic agent applied thereon to form an antistatic layer. Therefore, the designer can simply estimate the influence that the changes in the characteristics of the device have on the performance of the integrated circuit design.