Metal seed layers are deposited on a semiconductor substrate having recessed features by a method that involves depositing a first portion of seed layer material, subsequently selectively resputtering the deposited seed layer material in the presence of exposed diffusion barrier material, and, depositing a second portion of the seed layer material. A flexible, planar heater using an etched electrically resistive metallic foil heating element and attached temperature sensor provides regulated heat to the interior of the enclosure. Further, a length of each pointed member, from its outer tip to an adjacent trough is at least 5 inches and this length is not less than 30% nor more than 50% of the total length of the scoop in the direction of the elongated handle. Several spacer \u201cprofiles\u201d or cross-sections are disclosed that place less solid dielectric mass in proximity to the center conductor. Further, a single switch may be utilized for both controlling whether the camera records or plays images when there is no device connected, and which controls whether the camera transmits or receives images andor audio when an external device is determined to be connected.