The invention relates to a lateral semiconductor diode, in which contact metal fillings, which run in trenches in particular in a silicon carbide body, are interdigitated at a distance from one another, and a rectifying Schottky or pn junction is provided. The housing assembly can be configured to sealingly house electronics or other components. The reconfigurable processor can include a plurality of reconfigurable resources. Signal emitting and signal receiving of the wireless device is not affected by the thickness of the conductive composite material layer of the local portion. In still yet another embodiment, a decoder is provided for decoding an audio signal utilizing a clock that is independent of the audio signal. As a result, a moir\xe9 fringe is decreased.