There is disclosed a high precision positioning apparatus capable of realizing accurate positioning of a recording medium with respect to an optical system by minute movement at a relatively low cost. The semiconductor wafer is delivered with a conveyer to the wafer treatment device. In this latter case, the inlet throttling valve is not closed. The DCCI coupling method was chosen for the hydrophobic modification of PAA. If the inertial force reaches or exceeds a second threshold value greater than the first threshold value, then a latching mechanism employed in the S&A device latches to keep the electrical break irreversibly closed thereafter. The second and fourth primary windings are coupled in series to form a second coil member.