An improved contact nip roll, a method for assembling an improved contact nip roll, a system for nipping a web, and a method for nipping a web are provided. A sacrificial liner is formed along sidewalls of at least one opening in an insulating layer on a semiconductor wafer. Die modules on each of the single color printbars are spaced closer together but are not butted. The concaves are displaceable in a radial direction of the threshing drums and are formed with at least one crop-processing device disposed at the first concave. The first winding layer facing the core bonds to this core and, as a result, the finished roll is made mechanically strong and this strength can be enhanced by an adhesive-coated plastic foil tautly enclosing the outside of the roll and fitted with a projecting, adhesive free or adhesive-neutralized tear-open tab. An actuator including first and second cam mechanisms moves the support of each dispensing head assembly along the rotary path of movement of an adjacent open mold of the blow molding machine and angularly positions the support in alignment with a moving mold parting plane of the adjacent open mold in a manner that permits high speed operation of the in-mold labeling.