A resin composition applicable to semiconductor or electric devices comprises a polyarylenesulfide resin, a bisphenol epoxy resin, an oxazoline group-containing amorphous polymer, and an impact resistance-improving resin which is either an acid or epoxy groups-containing vinyl polymer, or an acid or epoxy groups-containing gum polymer. The method enables mobile device users to meet one another, on a permission basis. A system for igniting fuels using the method is also disclosed.