An intelligent connector assembly for use in an interface between a device and a cable, including: a block having a circuit thereon, the block being configured to be received onto a housing, with alignment features on the housing and the block such that the block is receivable in only one orientation into the housing, and a plurality of external interfaces on the block. The calculated amount of bills is compared with the number of bills beforehand inputted by the operator to thereby prevent an operation using a wrong number of bills. By depositing a second conductive layer on the resultant structure having the dielectric layer and patterning the dielectric layer, a capacitor upper electrode is formed in the memory cell array area and a second resistor device is formed in the peripheral circuit area. A crown is attached to the upper most end of each pier which offers a platform to provide a stable support once the jack is removed and easy access to the slab beam for later readjustment.