The present invention relates to an improved interpolation based on motion compensation. The control assembly includes not more than two sensor-actuators and a movable linkage assembly. A heat accumulator, containing both a heat medium and a heat storage phase change material, is mounted on the refrigerant line at a position between the cooling mode and heating mode expansion valves. A polycrystalline gate is formed for each of the semiconductor devices being fabricated. For the biodegradable release-sustaining base material, a lactic acid-glycolic acid copolymer with an adjusted distribution in molecular weight is used.