Technology for serving events to a plurality of client computing devices is disclosed. The one-piece chassis is coupled to the housing and configured to be enclosed within the housing. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The template is then removed to complete fabrication of the semiconductor device. According to the invention, one end of the rod comprises a light deflecting device.