A semiconductor component includes a semiconductor substrate that is formed with trench. Sub-images having different face sizes are generated using a received face image of a person to be identified. A transmitter circuit transmits the SMS messages, which encapsulate the IP packets, to a remote device via a communication network. Such decoupling circuitry can comprise use of pre-existing LSK circuitry during telemetry, or new discrete circuitry dedicated to decoupling. In response to receiving the instruction to delete the data file, multiple attribute bits of the first entry are programmed and also a first bit of the first entry is programmed. Further, the resin is preferably a thermoplastic resin and further preferably includes a thermoplastic resin including a soft segment in a molecule.