1459975165-e9294877-7a7c-42f6-9f24-a0b342b76a25

In one embodiment, a method for manufacturing a semiconductor device includes following steps. The antenna has a single signal feedline, connected to the central patch, and the side patches are shorted to the ground element. If a column address is applied, an evaluation unit which is connected downstream of the instruction decoder and has evaluation inputs which are connected to the address inputs, is used to apply a latency signal corresponding to the latency value to an output of the evaluation unit. The search engine runs searches based on a few of top ranked keywords, generates best matching search keywords, and provides the selected links as well as more links that relates to the best matching search keywords.