A motor vehicle has an exterior coating. A semiconductor integrated circuit is formed on the lower face of the semiconductor substrate. According to various embodiments of the invention, the group history may be presented in an overview form or a detailed form. The plurality of chips may be integrated on a single package or on a plurality of packages, which may comprise one or more circuit boards. The environmental coating is preferably sufficiently thin and ductile to enable compressive stresses to be induced in the underlying substrate through shot peening without cracking the coating. An object located on the plane is then extracted from an image that includes the plane and the object, and it is determined whether the object is a specific object.