A method for connecting electronic components, such as, an integrated circuit die and a package substrate, is described. The present invention also relates to methods for using such compounds, such as in screening and for inducing apoptosis. The surface characteristics may include charge density andor pKa. The masking layers together form a step opening structure that exposes the under-ball-metallic layer. The disclosure concerns a basic body for use with an outlet body, an outlet body for use with a basic body, as well as their combination in an outlet fitting wherein the outlet body forms a liquid container that is removable from the basic body and can be mounted, for example, on a washbasin or sink. However, since the lower part of the X-frame is fixed to the left and right side frames, and are vertically adjustable, the left and right side frames can be connected by the X-frames to correspond to the change of the height of the X-frame.