A method of forming an integrated circuit includes forming magnetic tunnel junction layers; etching the MTJ layers to form a MTJ cell; and forming a dielectric capping layer on sidewalls of the MTJ cell, wherein the step of forming the dielectric capping layer is in-situ performed with the step of etching the MTJ layers. An overlay panel is positioned on the exterior side of the appliance panel. Other methods and apparatus are presented in various embodiments, hence this abstract is not to be considered limiting, since other embodiments may deviate from the features described in this abstract. The example method may also include receiving a set of keys from the group controller and being assigned a role by the group controller.