A method and apparatus, for deploying a sensor attached to tubing in a highly deviated or horizontal wellbore, that are characterized by a stationary attachment system that securely fixes a sensor to a tubing string such that the sensor is coupled to the casing regardless of the orientation of the tubing within the wellbore. The document carrier sheet is also provided with a transparent sheet attached to the support sheet and permitting the document to be held on the support surface, with an image on the document being covered. In addition, the method also includes sawing partially through the lid street to form a trench in the lid street. The inventive processes and packaging are particularly suitable for integrating low or lower voltage circuits or transistors to form high voltage ICs, high voltage electronic devices and high voltage electronic circuits. The impurity diffusion stop layer substantially prevents impurities of the substrate and the source and drain regions from diffusing into the channel layer. These modules may be configured for rack mounting within enclosures for electrical components.