An interconnect structure, an interconnect structure for interconnecting first and second components, an interconnect structure for interconnecting a multiple component stack and a substrate, and a method of fabricating an interconnect structure. The invention utilizes the system’s circuit breaker to switch the current on or off, eliminating the need for a separate external disconnect. Full duplex communication may be realized by incorporating an echo canceler in the base station, or by utilizing both BFSK channels of the V. A top package may be bonded on the trimmed ends of the interconnects.