A semiconductor die has devices such as MOSgated devices, diodes and the like formed into the top and bottom surfaces of the die. A method comprises providing the fluid channel attachable to a body, modifying resultant vortices and reducing or minimizing shock formations or separation regions of the freestream. The ESD protection circuitry requires help from core protection circuit to protect the sensitive core circuit. The transfer power supplied to the one or more first transfer rollers and to the second transfer roller, respectively, is free from fluctuation during a period from the initiation of the first transfer operation performed first to the completion of the second transfer operation.