A stacked package for an electronic device and a method of manufacturing the stacked package include a first semiconductor package being formed with a first conductive pad and a second conductive pad. A first frame is thereby biased toward a second frame along the alignment axis to bias an integrated circuit package toward a socket. Flow of the cooling fluid is throttled when the temperature of the first surface drops at least 50 degrees below the freezing temperature of the cooled fluid. The PCB also carries substantially all the electronic components for the hearing aid thereon. In a preferred embodiment, during this drop in the output waveform, a p-channel type MOSFET of the buffer circuit is turned on, whereby the VDL is suppressed due to a back gate effect.