An implant for resurfacing at least a portion of an articulation surface of a bone includes a body having a first side with a top articular surface and an opposing second side with a bone apposition surface. An annealing process is performed to form an impurity region in the surface of the SiC semiconductor substrate by causing the susceptor and the C heating member to generate heat at high temperatures. Data structures are created to enable communication with the remote node to establish the connection with the remote node for the second communication protocol. An assignment unit dynamically assigns an identifier to each calling group of points and each receiving group of points in each local zone.