Substrate processing uniformity is improved in the surfaces of wafers and between the wafers. Each preform is mounted on the first rotary indexing table by a indexable mount for holding it in a first horizontal position or in a second position pivoted away from the first position, so that, when a preform is in the transfer position, the indexable mount can be pivoted, so that a parison in it drops into the pressing mold for pressing by the pressing tool. According to the method, the band of the press can be controlled by appropriately tilting the rotating rods.