An apparatus for chemically mechanically planarizing a semiconductor wafer is disclosed having a continuous polishing strip with first side having a fixed abrasive surface and a second side opposite the first side. A counterpoise element is located near the first end of the end-fed antenna, the end-fed antenna being adapted to be fed against the counterpoise element by the radio electronic circuits. Within the casing, a partition member is provided on the bottom surface section to extend vertically upward to the boundary section, and it has openings to permit communication between front and rear accommodating sections. The movement restrictor includes a restricting surface formed in the lug plate and a restricted surface formed in the cam plate and restricts the first receiving surface to move away from the first transmitting surface in the rotational direction of the drive shaft in such a manner that the restricted surface comes into contact with the restricting surface. A first value which corresponds to the actual noise level of the internal combustion engine is determined during a predetermined evaluation window and is compared with a second value, which corresponds to the actual noise level after phase adjustment of the camshaft, with the operation of the phase adjustment of the camshaft being assessed as a function of this comparison.