A conductive layer which is formed on an insulative layer on a semiconductor substrate is connected to the semiconductor substrate via a through portion which passes through the insulative layer and reaches the semiconductor substrate. The methods comprise applying an adhesive on an active surface of a semiconductor chip to form a patterned adhesive layer on a portion of the active surface. The white emissive layer is composed of a lamination of an orange organic emissive layer and a blue organic emissive layer. The load monitoring section monitors at least one of maximum value, average value and minimum value of the load in a certain procedure of a machining program.