The present invention discloses a method of manufacturing an integrated circuit on a semiconductor substrate having a semiconductor device provided thereon, including the steps of forming a copper layer having an overburden of a desired thickness, forming a layer of inert metal on the copper layer, annealing the copper layer and removing the layer of inert metal. A corresponding plurality of optical waveguides is also provided, with each waveguide having a first and a second end, with each first end being in optical communication with the corresponding LED die. An inside surface of the temples have a housing with walls defining a socket to receive a magnetic member. There can be a single multipurpose PPV channel for all PPV services or single PPV channels for groups of similar services, such as a Family PPV channel. Accordingly, it is possible to share a common encryption key within the ad hoc network. The abrasive article is adapted to clean a work surface area around studs using a rotary tool, including, for example, a drills or die grinder.