In one embodiment, a semiconductor package is formed to include a tamper barrier that is positioned between at least a portion of the connection terminals of the semiconductor package and an edge of the semiconductor package. In one particular exemplary embodiment, the technique may be realized as a variable aperture lens. This makes it possible to secure a larger volume of the fillet portion of the underfill, thereby helping improve the function of preventing the rising up of the excess underfill by providing a shelf in the semiconductor chip. The burst cup is embossed with a cross or other shape to promote predictable rupture. The signal analyzing mechanism analyzes the electric signal to detect a position of an obstacle when the obstacle is placed in the input region and blocks the light.