A semiconductor device, an interconnect structure, and methods of forming the same are disclosed. The method allows for the removal of impurities by controlling the polarity balance of a two-phase system by manipulating the proportions of the four solvents and subsequently the relative distribution of the product versus the impurities. Preferably, the non-elastic rope has a thickness such that it can be handled under tension without cutting one’s hands. A length of the time period is based on a first length in response to a type of the first networking frame being an acknowledgment frame type.