A semiconductor device includes a semiconductor substrate and a gate insulation layer formed over the semiconductor substrate. The invention also comprises the processes for preparing the compounds and the polymers, and to the use of these polymers for the manufacture of medical devices. Coupling projections on the pusher and on the abutment extend toward each other and have mutually engaging faces lying in planes extending at an acute angle to the axis. A shuttle assembly operates to remove the heated workpiece from the heater assembly and transfer it to the forming press for forming.