The present invention provides an elastomeric film having anti-skid properties. The power semiconductor element is mounted on a first surface of the first frame portion. The shock absorbing device further includes a stopper which is provided between the upper plate and the lower plate of the capsule such that the stopper is placed in the capsule locking slot of the bracket. Heat of the substrate can be radiated by the decorative cover while securing an electric insulation property with respect to the circuit pattern area. In operation, the apparatus examines the internal structure of the object using reflection mode acoustic microscopy, wherein emitted and reflected signals are carried between the acoustic transducer and the object by acoustic coupler. Corresponding decoder methods and apparatuses are also described.