A method and apparatus for unifying graphics processing unit computation languages is disclosed. With this arrangement, it is possible to transmit heat to toner and the recording medium in a short time. The semiconductor stacked package may include second circuit units disposed on each of the semiconductor chips and electrically disconnected with the coupling pads, connection pads disposed on each of the semiconductor chips and corresponding to the second circuit units, and blocking circuits coupled between the second circuit units and the connection pads. Moreover, the female connector comprises a second connector body with electric contacts extending towards the insertion end and being provided with free end portions which are elastically deformable. This process gives a crude mixture containing compound in addition to compound, after which the said mixture may be freed of the lightest compounds by distillation or may be subjected to a distillation to obtain the pure compound.