According to a preferred aspect of this invention, locations of defects on a semiconductor wafer are found using semiconductor defect inspection instrumentation. The backing member has a front face, a rear face, a top face, a bottom face, a first side face, and a second side face. A user can select at least an object image in the picture image and trigger a zoom key to zoom in or zoom out only the selected object image on the display device. The method enables cost-effective manufacture of preforms with crystallized neck finishes and enables production of a thermal resistant finish within a close dimensional tolerance. Further a SERS sensing device is presented which is implantable. The corrected received signal is then shifted through the probable deviations.