A semiconductor package that includes at least two semiconductor devices that are coupled to one another through a conductive clip. The invention also comprises a separation matrix, comprising the described ligands coupled to a porous support, such as particles or a membrane. The x-axis rotating part rotates a main surface of a wafer about an x-axis, and the y-axis rotating part rotates the main surface of the wafer about a y-axis. When a request for porting the portable phone number to a new service provider is received, the request is analyzed to determine whether the customer has authorized the requested port. The first and second coplanar transmission structures are electrically coupled together via substantially flat electrical conductors.