A hybrid laminated body is provided that includes a light-transmitting support, a latent release layer disposed upon the light-transmitting support, a joining layer disposed upon the latent release layer, and a polyamide thermoplastic priming layer disposed upon the joining layer. A substrate is configured to be operatively displaced with respect to each group so that printed voxels from each successive group can form successive layers of the structure upon the substrate. A resistance heating element film covering side and bottom surfaces of the recess and a storage element film filling the recess with the resistance heating element film interposed between the storage element film and the plug are formed. The determined dimensional characteristics are then turned into a plurality of perforations through an adhesive sheet so that they correspond to the dimensional characteristics of the existing emblem. Based on the historical data, one or more refined scope parameter may be determined. When designing a via hole that passes through a plurality of internal layers of the wiring board, the land information for an internal layer is applied to each internal layer through which the via hole passes.