A semiconductor package uses a plurality of thermal conductors that extend upward within an encapsulant from one or more thermal bond pads on a die to disperse heat. 1 part by mass to 100 parts by mass relative to 100 parts by mass of a thermoplastic elastomer component, or the second layer containing the styrene-isobutylene-styrene block copolymer by 10 mass % to 80 mass % relative to a thermoplastic elastomer component thereof. The second sourcedrain region is of a second conductivity type opposite the first conductivity type.