A test apparatus for a semiconductor package which has at least one chip and a plurality of solder balls includes a socket body, a circuit substrate, and a socket lid. A hair accessory configured to secure a bunch of hair is fitted with the power source, light emitting devices, and switch for the hair accessory to selectively display light by activating the switch. The contact surface of each of the fingers comprises a first tip portion that extends beyond the fixed conductor and has a first radius that is slightly greater than the radius of the telescopic conductor so that the first tip portion presents an arcuate width that overlies in wiping electrical contact the telescopic conductor when in the closed position.