In a method and system for inspecting alignment between an IC die and a package substrate, a plurality of fiducials are located on the package substrate for determining a plurality of references. Multi-member cables which are comprised of jacketed cables whose jackets are adhered together without the use of an adhesive element, such as by co-forming the jackets, and methods for manufacturing such cables are also discussed. The magnetic-field creating magnet and the armature winding are placed to locally face in a radial direction orthogonal to an axial direction.