Some embodiments include a die having an output control circuit to interact with an output circuit to convert a source voltage into at least one output voltage. The protection film protects an organic semiconductor layer of a semiconductor circuit and prevents intrusion of moisture or chemical molecules in the air, light, or the like, into the organic semiconductor layer. Multiple iterations of the routing segments are included in the packet, with the routing segments arranged in different sequences in different iterations. The casings are made of stainless steel and can be inserted to complete rapid assembly, providing features of convenient assembly, easy disassembly and multiple uses. Linear B-TH-cell epitopes, linear Tc-cell epitopes, dimers and multimers of those epitopes, and mixtures thereof, are used as low immunogenicity antigens.