A dielectric layer 2 is formed on a region including grid-shaped convex portions 1a of a resin substrate 1 having the grid-shaped convex portions 1a with pitches of 80 nm to 120 nm on its surface, and metal wires 3 are formed on the dielectric layer 2. The matching elements each comprise one or more lenses. In addition, an absorbent article may include at least one elastic member provided by the method and apparatus. The housing is configured to sustain a pressure substantially above atmospheric pressure. Then, the resist layer is removed and a solder mask layer is formed on the circuit board. The leg ball bearing retaining ring and leg ball bearings are positioned between the leg cover and the wheel ball.