A display has a screen which incorporates a light modulator. In the method, a case constituting an appearance of the damper assembly and having an open surface is molded, the case is inserted in a jig, the case is filled with a thermal insulating material to blow and mold the thermal insulating material, and a closing plate is coupled to the case to cover the open surface of the case. Additionally, the semiconductor chip of the present invention exhibits an improved heat radiation of the semiconductor chip over conventional semiconductor packages.