A silicon-on-insulator integrated, circuit is provided. Higher order devices support an overlaid dual logical network structure which allows two pairs of higher order devices to communicate simultaneously using two separate frequency bands. Therefore, in the present invention, the unique tread structure reliably suppresses heat-generation and the rubber of the tread rubber layer exhibits excellent tire wear resistance. A second conductive material is subsequently formed over the semiconductor to completely fill the wider opening. Output of the current availability status is controlled, such that the requester of the particular communication request is notified of an availability of the user to respond to the particular communication request. The first pattern mark may be a security mark or symbol, for example.