An LED module comprises: an LED element having an electrode for flip chip mounting; a wiring board having at least two metal layers and an electrically insulating layer including a polymer resin and being interposed between each two of the metal layers; and a metal film layer of the LED element for conducting heat from the LED element. The invention further relates to polyether polyols obtainable by this process, compositions containing said polyols and polyurethane polymers based on said polyols. Search results are trimmed to only include name, address, and phone number. In a second embodiment the heat exchanger is housed in the probe.