A patterning method comprises selectively depositing droplets of a first material solvent solution onto a layer of a second material. More specifically, the arrangement and method are directed to relieving stresses generated by the weight of the heat sink in the solder balls between the chip carrier package and a printed circuit board through a unique locking connection between the chip carrier package and the printed circuit board. A second memory cell has a third cell portion and a fourth cell portion. In addition, more narrow tracks are compatibly reproduced by the recording head.