Systems and methods for inspecting a wafer are provided. For example, in combination with a connected or attached user interface device, these modules provide a host with external-interface circuitry andor application-specific functions as well as second-level removable memory functions. The first CPM is adapted to operate in at least one of a second functional mode and a second scan mode. This allows failure and congestion protection systems to be implemented within the node while not requiring the use of a central cross-connect switch. A method and a system for measuring the relief of an object, using the above-mentioned process, is also disclosed. In one aspect, the method further includes applying a voltage between an anode and the plating surface to enhance the concentration of metal ions in the electrolyte solution that is contained in a feature on the plating surface prior to the bulk deposition on the plating surface.