A process for forming a thermally enhanced Chip On Board semiconductor device with a heat sink is described. The terminals are arranged and held in the housing. The fastener system can be associated with a cuff or other article so as to releasably maintain two opposing side edges of the cuff in proximity to each other. If no command is present in the direct command queue, a standard communication transaction is carried out. The wireless communication device also includes a secondary signal splitting carrier aggregation architecture. A center line extending along the first gate line is offset by a first predetermined amount from a line connecting a center of the first pillar-shaped semiconductor layer and a center of the second pillar-shaped semiconductor layer.