1460296559-1b0d51ba-3ca7-4e20-a3ed-188648a858e1

Methods for forming protective layers on semiconductor devices, including semiconductor devices that are carried by fabrication substrates, that are parts of assemblies, and that include individual dies, include at least partially consolidating previously unconsolidated material selectively, in accordance with a program. The armrest does not bother the armchair user when it is in its substantially vertical position, thus enabling manufacturers to exploit the maximum width allowed for this type of armchairs. The direction indicator may comprise an arrow. The thermal processing operationselenization operation converts the metal precursor layers to an absorber layer. An execution order of the plurality of tasks is switched by a group unit and, in accordance with a switched task group, information obtained from a LAN or information obtained from each device is processed by a CPU.