1460297858-6f90fc10-8ee8-45b6-8cba-adf45bdd19c9

A semiconductor device includes body lines, formed substantially perpendicular to a substrate, and having recessed sidewalls, buried bit lines, buried in the recessed sidewalls, and including a metal silicide, and a barrier layer interposed between each of the buried bit lines and the body lines corresponding thereto, and containing germanium. In one specific embodiment, the method involves creating and storing information that represents a logical decomposition of the next generation network into a plurality of discrete functional areas. The head is formed on a front end of the handle and has a connecting block, a fixed jaw, a curved slot, a positioning pin, a mounting recess and a sliding slot. While improving readability of the code, the non-literal representation may also retain important information about the underlying code associated with the non-literal representation. The program compiling unit modifies the compiling scheme to recompile the program code and transmits the new assembly codes to the DSP simulator, until the simulation results reach or are lower than a predetermined energy consumption value.