A thin film transistor substrate with good process efficiency and a method of manufacturing the same are provided. The package may further comprises a bypass capacitor configured as a third chip mounted on the first die pad or integrated with the first chip. The micro-electrical discharge machine based metrology system is a non-contact, non-destructive, and on-board metrology system capable of in-process quality assurancequality control. The hooks are hooked to two sides of the chip set and the flexible rods press on the heatsink.